Flexible Printed Circuit Board Fabrication
Circuits offer a variety of surface finishes, materials and capabilities to meet customer specifications. Our standard lead time for flexible circuits is 10-days however; accelerated turnaround is available for prototyping and low volume product with time-critical engineering and delivery requirements. An overview of our specifications are as follows:
|
Flexible PCB Specifications |
| Flex Materials |
DuPont Pyralux AC, AP, FR and LF |
| Copper Weight |
¼ oz to 3 oz |
| Core Thickness |
.001” to .007” |
| Board Thickness |
.002” to .125” |
| Layer Count |
1-14 |
| Max board Size |
22”x16” |
| Lead Time |
3 to 10(*) Days |
| Specifications |
IPC-6013(*), MIL-PRF-31032 |
| Trace/Space |
.003”/.003” |
| Via Structure |
Through, Blind, Buried, Microvias |
| Hole Sizes |
.002” to .250” |
| Surface Finish |
ENIG (*), HAL, Hard and Soft Gold, Immersion Silver, OSP |
| Surface Coatings |
Coverlay Pyralux™ LF(*), LPI |
(*) Denotes standard process/capabilities
Processes and Equipment
Our new 50,000 square foot fabricating and testing facility houses a built-to-purpose, flow-optimized workspace specifically designed and equipped to produce reliable, high-quality flexible printed circuits with minimum handling and transport. The PCB manufacturing facility features a fully-integrated Class 1,000 clean room, a laser driller/router and a custom plating line configured for the production of complex circuits. To learn more about Circuits processes and equipment throughout the plant, click on the area below.